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2UUL BG03 CPU BGA-reballingstencil 0,12 mm voor iPhone 17 geschikt-voor-acer-aspire-7735zg-424g50mn duurzaam en moeiteloos vast teReballing the CPU on an iPhone 17 motherboard? You need a precise stencil that works cleanly. The 2UUL BG03 with 0. 12 mm pinholes ensures exact placement of solder balls on the iPhone 17 series CPU pads. Specifications Pinhole size 0. 12 mm Nickel plated steel Specifically for iPhone 17 CPU Wear resistant and dimensionally stable Heat resistant Reusable when handled correctly Signs of a faulty unit CPU no contact after reballing Solder balls shift
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